IC Sockets

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
A 08-LC-TT CONN IC DIP SOCKET 8POS TIN Assmann WSW Components	82 767 In Stock	1 : € 0,14000 Tube	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 85°C
1-2199298-2 CONN IC DIP SOCKET 8POS TIN TE Connectivity AMP Connectors	15 333 In Stock	1 : € 0,19000 Tube	Diplomate DL	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
A 14-LC-TT CONN IC DIP SOCKET 14POS TIN Assmann WSW Components	29 628 In Stock	1 : € 0,20000 Tube	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 85°C
110-87-308-41-001101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	8 766 In Stock	1 : € 0,33000 Box	110	Box	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AR 08-HZL-TT CONN IC DIP SOCKET 8POS TIN Assmann WSW Components	9 862 In Stock	1 : € 0,48000 Tube	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
A 40-LC-TT CONN IC DIP SOCKET 40POS TIN Assmann WSW Components	4 666 In Stock	1 : € 0,52000 Tube	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 85°C
110-44-308-41-001000 CONN IC DIP SOCKET 8POS TIN Mill-Max Manufacturing Corp.	7 441 In Stock	1 : € 0,61000 Tube	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
SA143000 CONN IC DIP SOCKET 14POS GOLD On Shore Technology Inc.	2 394 In Stock	1 : € 0,63000 Tube	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
SA163000 CONN IC DIP SOCKET 16POS GOLD On Shore Technology Inc.	8 984 In Stock	1 : € 0,72000 Tube	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
SA203000 CONN IC DIP SOCKET 20POS GOLD On Shore Technology Inc.	2 745 In Stock	1 : € 0,88000 Tube	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
AR 16-HZL-TT CONN IC DIP SOCKET 16POS TIN Assmann WSW Components	4 819 In Stock	1 : € 0,90000 Tube	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
110-43-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	17 856 In Stock	1 : € 1,16000 Tube	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-93-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	2 709 In Stock	1 : € 1,19000 Tube	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-87-308-41-105191 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	2 988 In Stock	1 : € 1,23000 Cut Tape (CT) 700 : € 0,77501 Tape & Reel (TR)	110	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
1050281001 CONN CAM SOCKET 32POS GOLD Molex	10 706 In Stock	1 : € 1,40000 Cut Tape (CT) 800 : € 1,23664 Tape & Reel (TR)	105028	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Camera Socket	32 (4 x 8)	0.035" (0.90mm)	Gold	12.0µin (0.30µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.035" (0.90mm)	Nickel	50.0µin (1.27µm)	Copper Alloy	Thermoplastic	-
110-44-424-41-001000 CONN IC DIP SOCKET 24POS TIN Mill-Max Manufacturing Corp.	2 209 In Stock	1 : € 1,56000 Tube	110	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
69802-432LF CONN SOCKET PLCC 32POS TIN Amphenol ICC (FCI)	11 418 In Stock	1 : € 1,59000 Cut Tape (CT) 390 : € 1,03974 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 125°C
940-44-032-17-400000 CONN SOCKET PLCC 32POS TIN Mill-Max Manufacturing Corp.	2 146 In Stock	1 : € 1,59000 Tube	940	Tube	Active	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
10-3513-10 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	839 In Stock	1 : € 1,60000 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
SA406000 CONN IC DIP SOCKET 40POS GOLD On Shore Technology Inc.	3 054 In Stock	1 : € 1,65000 Tube	SA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
D2820-42 CONN IC DIP SOCKET 20POS GOLD Harwin Inc.	4 712 In Stock	1 : € 1,69000 Tube	D2	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic	-55°C ~ 125°C
D01-9972042 CONN SOCKET SIP 20POS GOLD Harwin Inc.	2 675 In Stock	1 : € 1,69000 Tube	D01-997	Tube	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
08-3518-00 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	3 040 In Stock	1 : € 1,72000 Tube	518	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
110-44-628-41-001000 CONN IC DIP SOCKET 28POS TIN Mill-Max Manufacturing Corp.	1 698 In Stock	1 : € 1,79000 Tube	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-44-328-41-001000 CONN IC DIP SOCKET 28POS TIN Mill-Max Manufacturing Corp.	925 In Stock	1 : € 1,79000 Tube	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C

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Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

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