IC Sockets

Showing

of 197

Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
08-2513-10 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	3 243 In Stock	1 : € 3,30000 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-3513-10 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	1 798 In Stock	1 : € 2,08000 Tube	Lo-PRO®file, 513	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
18-6513-10 CONN IC DIP SOCKET 18POS GOLD Aries Electronics	762 In Stock	1 : € 4,02000 Tube	Lo-PRO®file, 513	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-2513-10 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	209 In Stock	1 : € 2,08000 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
08-4513-10 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	53 In Stock	1 : € 1,72000 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
40-9513-10 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	47 In Stock	1 : € 9,31000 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.9" (22.86mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
16-3513-10 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	0 In Stock Check Lead Time	1 : € 2,63000 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-2513-10 CONN IC DIP SOCKET 2POS GOLD Aries Electronics	0 In Stock Check Lead Time	863 : € 0,41345 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	2 (1 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-3513-10 CONN IC DIP SOCKET 2POS GOLD Aries Electronics	0 In Stock Check Lead Time	863 : € 0,41345 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	2 (1 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-4513-10 CONN IC DIP SOCKET 2POS GOLD Aries Electronics	0 In Stock Check Lead Time	863 : € 0,41345 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	2 (1 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
06-3513-10 CONN IC DIP SOCKET 6POS GOLD Aries Electronics	0 In Stock Check Lead Time	360 : € 1,06056 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
06-2513-10 CONN IC DIP SOCKET 6POS GOLD Aries Electronics	0 In Stock Check Lead Time	330 : € 1,06709 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
08-3513-10 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	0 In Stock Check Lead Time	315 : € 1,14156 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-6513-10 CONN IC DIP SOCKET 2POS GOLD Aries Electronics	0 In Stock Check Lead Time	297 : € 1,18178 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	2 (1 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
06-6513-10 CONN IC DIP SOCKET 6POS GOLD Aries Electronics	0 In Stock Check Lead Time	297 : € 1,18178 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
08-6513-10 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	0 In Stock Check Lead Time	263 : € 1,33411 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
12-3513-10 CONN IC DIP SOCKET 12POS GOLD Aries Electronics	0 In Stock Check Lead Time	230 : € 1,52422 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
14-3513-10 CONN IC DIP SOCKET 14POS GOLD Aries Electronics	0 In Stock Check Lead Time	225 : € 1,59711 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-6513-10 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	0 In Stock Check Lead Time	216 : € 1,61935 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
08-6513-11 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	0 In Stock Check Lead Time	207 : € 1,69039 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
06-3513-11 CONN IC DIP SOCKET 6POS GOLD Aries Electronics	0 In Stock Check Lead Time	240 : € 1,71200 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
04-3513-11 CONN IC DIP SOCKET 4POS GOLD Aries Electronics	0 In Stock Check Lead Time	202 : € 1,73297 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
12-4513-10 CONN IC DIP SOCKET 12POS GOLD Aries Electronics	0 In Stock Check Lead Time	200 : € 1,75180 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
08-3513-00 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	0 In Stock Check Lead Time	225 : € 1,78960 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
08-3513-11 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	0 In Stock Check Lead Time	225 : € 1,81782 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C

Showing

of 197

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

IC Sockets

IC Sockets

Subscribe

Information

Contact and support